Intel Accelerates Process and Packaging Innovations


Taken from Youtube – Intel NewRoom

During the “Intel Accelerated” webcast, Intel’s technology leaders revealed one of the most detailed process and packaging technology roadmaps the company has provided. The event on July 26, 2021, showcased a series of foundational innovations that will power products through 2025 and beyond. As part of the presentations, Intel announced RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method. (Credit: Intel Corporation)

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